 |
 |
| |
3/3 Line and Space Line and Space |
| |
3 Build Up HDI (Lase Vias) |
| |
Buried Blind via Sequential Lamination |
| |
16:1 Aspect Ratio |
| |
Aluminum Base Plate Heat Sink Double Sided PCB |
| |
.200” Board Thickness |
| |
.002” Thin Core |
| |
+/- 0.002” Finish Hole Tolerance |
| |
Surface finish, HASL, Hi-Temp OSP, Immersion Ag, ENIG, ENEPIG, Selective Gold Plating, Immersion Tin, Carbon Ink. |
| |
Heavy Copper (UL appeared up to 12 oz internal layers) |
| |
Bellcore TR-NWT-00078 Compliant |
| |
Minimum Finish Hole Size: .004” (Both Mechanical and Laser Drills) |
| |
36 Layers Board Manufacturing |
| |
Cavity Plating |
| |
RF Board Manufacturing |
